ISL29028A
Absolute Maximum Ratings (T A = +25 ° C)
V DD Supply Voltage between V DD and GND . . . . . . . . . . . . . . . . . . . . . .4.0V
I 2 C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
I 2 C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA
R EXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
IRDR Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V
ADDR0 Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V
Thermal Information
Thermal Resistance (Typical) θ JA (°C/W) θ JC (°C/W)
8 Ld ODFN Package (Notes 4, 5) . . . . . . . . 88 10
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +100°C
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
INT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V
INT Pin Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA
ESD Rating
Human Body Model (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379 .
5. For θ JC , the “case temp” location is the center of the exposed metal pad on the package underside.
6. ESD on all pins is 2kV except for IRDR, which is 1.5kV.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise
noted, all tests are at the specified temperature and are pulsed tests, therefore: T J = T C = T A
Electrical Specifications
V DD = 3.0V, T A = +25°C, R EXT = 499k Ω 1% tolerance.
MIN
MAX
PARAMETER
DESCRIPTION
CONDITION
(Note 12) TYP (Note 12) UNIT
V DD
SR_V DD
I DD_OFF
I DD_NORM
Power Supply Range
Input Power-up Slew Rate
Supply Current when Powered Down
Supply Current for ALS+Prox in Sleep Time
V DD Rising Edge between 0.4V and 2.25V
ALS_EN = 0; PROX_EN = 0
ALS_EN = 1; PROX_EN = 1
2.25
0.5
3.0
0.1
110
3.63
0.8
125
V
V/ms
μA
μA
I DD_PRX_SLP Supply Current for Prox in Sleep Time
ALS_EN = 0; PROX_EN = 1
80
μA
I DD_ALS
f OSC
Supply Current for ALS
Internal Oscillator Frequency
ALS_EN = 1; PROX_EN = 0
96
5.25
μA
MHz
t INTGR_ALS
t INTGR_PROX
12-bit ALS Integration/Conversion Time
8-bit Prox Integration/Conversion Time
88
100
0.54
112
ms
ms
Linearity ALS_1 Nonlinearity
E AMBIENT = 0, 53, 90 Lux; ALS_RANGE = 0
(Note 7)
-6
0.5
+6
%
DATA ALS_0
ALS Result when Dark
E AMBIENT = 0 lux, 2k Range
1
3
Counts
DATA ALS_F
Δ DATA
Full Scale ALS ADC Code
Count Output Variation Over Three Light Sources:
E AMBIENT > Selected Range Maximum Lux
(Note 11)
Ambient Light Sensing
±10
4095
Counts
%
DATA
Fluorescent, Incandescent and Sunlight
DATA ALS_1
Light Count Output with LSB of 0.0326 Lux/Count
E = 53 lux, Fluorescent (Notes 8 , 11),
ALS_RANGE = 0
1638
Counts
DATA ALS_2
DATA PROX_0
Light Count Output With LSB of 0.522 Lux/Count
Prox Measurement w/o Object in Path
E = 320 lux, Fluorescent (Note 8),
ALS_RANGE = 1
460
614
1
768
2
Counts
Counts
DATA PROX_F
Full Scale Prox ADC Code
255
Counts
DATA PROX_1
t r
t f
Prox Measurement Result
Rise Time for IRDR Sink Current
Fall time for IRDR Sink Current
(Note 9)
R LOAD = 15 Ω at IRDR pin, 20% to 80%
R LOAD = 15 Ω at IRDR pin, 80% to 20%
36
46
500
500
56
Counts
ns
ns
3
FN7721.3
January 29, 2014
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